36807 ENGINEERING MATERIALS LECTURE # 1 INTRODUCTION TO ENGINEERING MATERIALS ------------------------------------- 1.- THE MATERIALS CYCLE 1.1.- RAW MATERIALS ---> BASIC MATERIALS ---> ENGINEERING MATERIALS + WASTE 2.- SCIENTIFIC FOUNDATIONS OF A SCIENCE OF MATERIALS 2.1.- STRUCTURE 2.2.- THERMODYNAMICS 2.3.- KINETICS 3.- MATERIALS PROPERTIES FOR ENGINEERING APPLICATIONS 3.1.- MECHANICAL PROPERTIES 3.2.- ELECTRIC, MAGNETIC, OPTICAL, AND THERMAL PROPERTIES 3.3.- CHEMICAL PROPERTIES 4.- A CLASSIFICATION OF MATERIALS 4.1.- METALLICS: METALS AND ALLOYS 4.2.- NONMETALLICS: SEMICONDUCTORS, CERAMICS AND GLASSES 4.3.- NONMETALLICS: ORGANIC POLYMERS 4.4.- COMPOSITE MATERIALS 4.5.- NATURAL MATERIALS 5.- MATERIALS PROCESSING ---> MATERIAL STRUCTURES ---> MATERIALS PROPERTIES ---> MATERIALS PERFORMANCE 5.1.- PROCESSING METHODS FOR METALS AND ALLOYS 5.2.- PROCESSING METHODS FOR SEMICONDUCTORS, CERAMICS AND GLASSES 5.3.- PROCESSING METHODS FOR ORGANIC POLYMERS 5.4.- PROCESSING METHODS FOR COMPOSITE MATERIALS 6.- MATERIALS SELECTION AND DESIGN WITH MATERIALS 6.1.- MATERIALS SELECTION 6.2.- DESIGN WITH MATERIALS Reading Assignment: ASKELAND: pp. ix-xvii, pp. 1-21 HANDOUT BY WATERMAN, pp. 1-13 Written Assignment: ASKELAND: PRACTICE PROBLEMS 1-20 pp. 20-21 36807 ENGINEERING MATERIALS LECTURE # 1 INTRODUCTION TO ENGINEERING MATERIALS ------------------------------------- 1.- THE MATERIALS CYCLE 1.1.- RAW MATERIALS ---> BASIC MATERIALS ---> ENGINEERING MATERIALS + WASTE * COST FACTORS, PRICE FACTORS AND TECHNICAL FACTORS IN THE PRODUCTION OF MATERIALS * THE SYSTEMS APPROACH TO MATERIALS TECHNOLOGY 2.- SCIENTIFIC FOUNDATIONS OF A SCIENCE OF MATERIALS 2.1.- STRUCTURE * LEVELS OF STRUCTURE AND KINDS OF STRUCTURE * ATOMS, MOLECULES, CLUSTERS AND CONDENSED PHASES * A CLASSIFICATION OF SOLIDS * ATOMIC ARRANGEMENTS IN CRYSTALLINE SOLIDS * CRYSTALLINE DEFECTS * RELATIONSHIPS BETWEEN CRYSTALLINITY AND PROPERTIES * MATERIALS CHARACTERIZATION METHODS 2.2.- THERMODYNAMICS * INTRODUCTION * TYPES OF EQUILIBRIA * EQUILIBRIUM IN MULTIPHASE, MULTICOMPONENT SYSTEMS * EQUILIBRIA INVOLVING INTERFACES * ELECTROCHEMICAL EQUILIBRIA 2.3.- KINETICS * INTRODUCTION * DIFFUSION PROCESSES * CHEMICAL REACTION PROCESSES * ELECTROCHEMICAL PROCESSES * PHASE TRANSFORMATIONS * ELECTRICAL PROCESSES * KINETICS OF DEFORMATION 3.- MATERIALS PROPERTIES FOR ENGINEERING APPLICATIONS 3.1.- MECHANICAL PROPERTIES * DEFORMATION AND FLOW PHENOMENA @ LOW TEMPERATURE DEFORMATION @ HIGH TEMPERATURE DEFORMATION * FRACTURE PHENOMENA @ LOW TEMPERATURE FRACTURE @ HIGH TEMPERATURE FRACTURE 3.2.- ELECTRIC, MAGNETIC, OPTICAL, AND THERMAL PROPERTIES * ELECTRICAL @ CONDUCTIVITY @ POLARIZABILITY * MAGNETIC @ MAGNETIZATION @ PERMEABILITY @ TYPES OF MAGNETIC BEHAVIOR @ MAGNETIC DOMAINS AND HYSTERESIS * OPTICAL PROPERTIES @ EMISSION ABSORPTION AND TRANSMISSION OF RADIATION @ PHOTON-MATERIAL INTERACTIONS * THERMAL PROPERTIES @ HEAT CAPACITY @ THERMAL EXPANSION @ THERMAL CONDUCTIVITY 3.3.- CHEMICAL PROPERTIES * INTRODUCTION TO CHEMICAL REACTIVITY * LOW TEMPERATURE (WET) CORROSION * HIGH TEMPERATURE (DRY) CORROSION 4.- A CLASSIFICATION OF MATERIALS 4.1.- METALLICS: METALS AND ALLOYS * CLASSIFICATION OF METALS AND ALLOYS * FERROUS ALLOYS * HIGH TEMPERATURE ALLOYS * LIGHT METAL ALLOYS * HEAVY METAL ALLOYS * TOOL MATERIALS * INTERMETALLICS 4.2.- NONMETALLICS: SEMICONDUCTORS, CERAMICS AND GLASSES * SEMICONDUCTORS @ SILICON @ NON-SILICON * CERAMICS @ SILICATE CERAMICS @ OTHER OXIDE CERAMICS @ CARBIDE AND NITRIDE CERAMICS * GLASSES * GLASS-CERAMICS 4.3.- NONMETALLICS: ORGANIC POLYMERS * THERMOPLASTIC POLYMERS * THERMOSETTING POLYMERS * ELASTOMERS 4.4.- COMPOSITE MATERIALS * METAL MATRIX COMPOSITES * POLYMER MATRIX COMPOSITES * CERAMIC MATRIX COMPOSITES * CARBON FIBER COMPOSITES 4.5.- NATURAL MATERIALS * INORGANIC MATERIALS * ORGANIC MATERIALS 5.- MATERIALS PROCESSING ---> MATERIAL STRUCTURES ---> MATERIALS PROPERTIES ---> MATERIALS PERFORMANCE 5.1.- PROCESSING METHODS FOR METALS AND ALLOYS 5.2.- PROCESSING METHODS FOR SEMICONDUCTORS, CERAMICS AND GLASSES 5.3.- PROCESSING METHODS FOR ORGANIC POLYMERS 5.4.- PROCESSING METHODS FOR COMPOSITE MATERIALS 6.- MATERIALS SELECTION AND DESIGN WITH MATERIALS 6.1.- MATERIALS SELECTION 6.2.- DESIGN WITH MATERIALS Reading Assignment: ASKELAND: pp. ix-xvii, pp. 1-21 HANDOUT BY WATERMAN, pp. 1-13 Written Assignment: ASKELAND: PRACTICE PROBLEMS 1-20 pp. 20-21 36807 ENGINEERING MATERIALS LECTURE # 2 STRUCTURE OF MATERIALS ---------------------- 1.- ATOMS, MOLECULES, CLUSTERS AND CONDENSED PHASES 1.1.- ATOMIC STRUCTURE 1.2.- THE PERIODIC TABLE OF THE ELEMENTS 1.3.- ATOMIC BONDING 1.4.- ATOM CLUSTERS 1.5.- CONDENSED PHASES 2.- VARIOUS MEANINGS OF THE TERM STRUCTURE 2.1.- STRUCTURE AS ATOMIC ARRANGEMENT 2.2.- STRUCTURE AS ELECTRONIC ARRANGEMENT 2.3.- (MICRO)STRUCTURE 2.4.- (MACRO)STRUCTURE 3.- A CLASSIFICATION OF SOLIDS 3.1.- CRYSTALLINE SOLIDS 3.2.- NON-CRYSTALLINE SOLIDS 3.3.- INTERMEDIATE CASES 4.- ATOMIC ARRANGEMENTS IN CRYSTALLINE SOLIDS 4.1.- INTRODUCTION TO CRYSTALLOGRAPHY 4.2.- MOTIVE AND LATTICE 4.3.- BRAVAIS LATTICES 4.4.- UNIT CELLS, LATTICE POINTS, LATTICE DIRECTIONS AND LATTICE PLANES 4.5.- EXAMPLES OF CRYSTALLINE STRUCTURES 5.- DEFECTS 5.1.- PHONONS AND CHARGED DEFECTS 5.2.- POINT DEFECTS 5.3.- LINE DEFECTS 5.4.- PLANAR DEFECTS 6.- EFFECT OF CRYSTALLINE STRUCTURE ON ELECTRONIC STRUCTURE 6.1.- INTERACTION BETWEEN ELECTRONS AND THE LATTICE IN A CRYSTAL 6.2.- BRILLOUIN ZONES 7.- EFFECT OF CRYSTALLINE STRUCTURE ON PROPERTIES 7.1.- MECHANICAL PROPERTIES 7.2.- NON-MECHANICAL PROPERTIES 8.- NON-CRYSTALLINE SOLIDS 8.1.- ATOMIC ARRANGEMENTS IN LIQUIDS 8.2.- ATOMIC ARRANGEMENTS IN AMORPHOUS SOLIDS 9.- MATERIALS CHARACTERIZATION METHODS 9.1.- DIFFRACTION METHODS 9.2.- ELECTRON MICROSCOPY 9.3.- OPTICAL MICROSCOPY 9.4.- SPECTROSCOPY 9.5.- OTHER STRUCTURAL CHARACTERIZATION TECHNIQUES Reading Assignment: Askeland; pp. 23-116: Ch. 2 - 4. Written Assignment: Askeland; End of Chapter problems for Ch. 2-4 as follows: Every other third problem from Ch. 2 Every other seventh problem from Ch. 3 Every other fifth problem from Ch. 4 36807 ENGINEERING MATERIALS LECTURE # 2 STRUCTURE OF MATERIALS ---------------------- 1.- ATOMS, MOLECULES, CLUSTERS AND CONDENSED PHASES 1.1.- ATOMIC STRUCTURE * CONCEPTUAL MODELS OF THE ATOM * THE HYDROGEN ATOM 1.2.- THE PERIODIC TABLE OF THE ELEMENTS * ELECTRONIC STRUCTURE AND PERIODICITY * s-BLOCK ELEMENTS * p-BLOCK ELEMENTS * d-BLOCK ELEMENTS * f-BLOCK ELEMENTS 1.3.- ATOMIC BONDING * ATOMIC MIXTURES * TYPES OF ATOMIC BONDS @ IONIC @ COVALENT @ METALLIC @ VAN-DER WAALS * ATOMIC BOND AND PROPERTIES 1.4.- ATOM CLUSTERS * MACROMOLECULES * COLLOIDS 1.5.- CONDENSED PHASES * LIQUIDS * SOLIDS 2.- VARIOUS MEANINGS OF THE TERM STRUCTURE 2.1.- STRUCTURE AS ATOMIC ARRANGEMENT 2.2.- STRUCTURE AS ELECTRONIC ARRANGEMENT 2.3.- (MICRO)STRUCTURE 2.4.- (MACRO)STRUCTURE 3.- A CLASSIFICATION OF SOLIDS 3.1.- CRYSTALLINE SOLIDS 3.2.- NON-CRYSTALLINE SOLIDS 3.3.- INTERMEDIATE CASES 4.- ATOMIC ARRANGEMENTS IN CRYSTALLINE SOLIDS 4.1.- INTRODUCTION TO CRYSTALLOGRAPHY 4.2.- MOTIVE AND LATTICE 4.3.- BRAVAIS LATTICES 4.4.- UNIT CELLS, LATTICE POINTS, LATTICE DIRECTIONS AND LATTICE PLANES 4.5.- EXAMPLES OF CRYSTALLINE STRUCTURES * METAL CRYSTALS * CERAMIC CRYSTALS * ORGANIC POLYMER CRYSTALS 5.- DEFECTS 5.1.- PHONONS AND CHARGED DEFECTS * PHONONS * ELECTRONS AND HOLES (P IN Si; AS IN Si) 5.2.- POINT DEFECTS * VACANCIES * INTERSTITIALS * IMPURITY ATOMS @ INTERSTITIAL @ SUBSTITUTIONAL * COMPUND DEFECTS @ EXCITONS (GaAs) @ F-CENTERS (KBr) @ SCHOTTKY (KCl) @ FRENKEL (AgBr) 5.3.- LINE DEFECTS * ELEMENTARY RELATIVE DISPLACEMENT OF ATOMS IN A CRYSTAL (SLIP) * A CRYSTAL CONTAINING SLIPPED VS. NON-SLIPPED PORTIONS OF MATERIAL IN DIRECT CONTACT * TYPES OF DISLOCATIONS @ SCREW @ EDGE @ MIXED 5.4.- PLANAR DEFECTS * GRAIN BOUNDARIES @ LOW ANGLE (TILT AND TWIST) @ HIGH ANGLE * INTERPHASE INTERFACES @ COHERENCY * FREE SURFACES 6.- EFFECT OF CRYSTALLINE STRUCTURE ON ELECTRONIC STRUCTURE 6.1.- INTERACTION BETWEEN ELECTRONS AND THE LATTICE IN A CRYSTAL 6.2.- BRILLOUIN ZONES 7.- EFFECT OF CRYSTALLINE STRUCTURE ON PROPERTIES 7.1.- MECHANICAL PROPERTIES 7.2.- NON-MECHANICAL PROPERTIES 8.- NON-CRYSTALLINE SOLIDS 8.1.- ATOMIC ARRANGEMENTS IN LIQUIDS 8.2.- ATOMIC ARRANGEMENTS IN AMORPHOUS SOLIDS 9.- MATERIALS CHARACTERIZATION METHODS 9.1.- DIFFRACTION METHODS * X-RAYS * ELECTRONS * NEUTRONS 9.2.- ELECTRON MICROSCOPY * TRANSMISSION * SCANNING 9.3.- OPTICAL MICROSCOPY 9.4.- SPECTROSCOPY * X-RAY * AUGER ELECTRON * ATOMIC ABSORPTION 9.5.- OTHER STRUCTURAL CHARACTERIZATION TECHNIQUES * SCANNING TUNNELING MICROSCOPE Reading Assignment: Askeland; pp. 23-116: Ch. 2 - 4. Written Assignment: Askeland; End of Chapter problems for Ch. 2-4 as follows: Every other third problem from Ch. 2 Every other seventh problem from Ch. 3 Every other fifth problem from Ch. 4 36807 ENGINEERING MATERIALS LECTURE # 3 THERMODYNAMICS OF MATERIALS --------------------------- 1.- INTRODUCTION 1.1.- DEFINITION OF TERMS * SYSTEM AND SURROUNDINGS * STABILITY AND EQUILIBRIUM STATES * THE LAWS OF THERMODYNAMICS * AUXILIARY FUNCTIONS OF THERMODYNAMICS 1.2.- THERMODYNAMICS VS. KINETICS 2.- TYPES OF EQUILIBRIA 2.1.- EQUILIBRIUM IN A GRAVITATIONAL FIELD 2.2.- EQUILIBRIUM IN ELECTRIC SYSTEMS 2.3.- THERMAL EQUILIBRIUM 2.4.- MECHANICAL EQUILIBRIUM 2.5.- CHEMICAL EQUILIBRIUM 2.6.- ELECTROCHEMICAL EQUILIBRIUM 3.- CHEMICAL EQUILIBRIA IN GAS-PHASE SYSTEMS 3.1.- CHEMICAL POTENTIAL 3.2.- EQUILIBRIUM CONDITION FOR A REACTING GAS MIXTURE 3.3.- EQUILIBRIUM CONSTANT * DEFINITION * DEPENDENCY ON TEMPERATURE (VAN'T HOFF) 4.- EQUILIBRIUM IN MULTIPHASE SYSTEMS 4.1.- GIBBS PHASE RULE 4.2.- SINGLE COMPONENT SYSTEMS * PHASE TRANSITIONS * PHASE DIAGRAMS 4.3.- GAS-SOLID SYSTEMS * ELLINGHAM DIAGRAMS 4.4.- MULTI-COMPONENT SYSTEMS * TWO COMPONENT SYSTEMS * PHASE DIAGRAMS * TERNARY SYSTEMS 5.- EQUILIBRIA INVOLVING INTERFACES 5.1.- SURFACE FREE ENERGY 5.2.- SURFACE ENERGIES OF MATERIAL SURFACES 5.3.- INTERFACIAL SEGREGATION (ADSORPTION ISOTHERM) 5.4.- EFFECTS OF SIZE * THE DROPLET-VAPOR SYSTEM 6.- ELECTROCHEMICAL EQUILIBRIA 6.1.- ELECTROCHEMICAL POTENTIAL 6.2.- ELECTROCHEMICAL CELLS * HALF-CELL RACTIONS * HALF-CELL VOLTAGE 6.3.- POURBAIX (VOLTAGE-pH) DIAGRAMS Reading Assignment: Askeland; Secs. 9.1-9.4, 9.6, 9.8 10.3-10.5, 10.8-10.10, 11.3, 11.9-11.10, 12.2, 12.11-12.12, Figs. 13.4, 13.6, 13.8 Sects. 14.7, 20.1-20.4 Written Assignment: Two problems of your choice from each one of Chapters 9, 10, 11, 12, 13, 14, 20 36807 ENGINEERING MATERIALS LECTURE # 4 KINETIC PROCESSES IN MATERIALS ------------------------------ 1.- INTRODUCTION 1.1.- RATE PHENOMENA 1.2.- TRANSIENT, STEADY AND EQUILIBRIUM STATES 1.3.- TYPES OF RATE PROCESSES 2.- DIFFUSION PROCESSES 2.1.- DIFFUSION MECHANISMS 2.2.- THE DIFFUSION COEFFICIENT * DEFINITION * THE EFFECT OF TEMPERATURE 2.3.- MACROSCOPIC ANALYSIS OF DIFFUSION * DIFFUSIONAL FLUX * FICK'S LAWS 2.4.- SOME SOLUTIONS OF THE DIFFUSION EQUATION 3.- CHEMICAL REACTION PROCESSES 3.1.- REACTION MECHANISMS * RATE OF REACTION * ACTIVATED COMPLEX THEORY OF REACTION RATES * HOMOGENEOUS VS. HETEROGENEOUS REACTIONS 3.2.- BASIC LAW OF CHEMICAL KINETICS * MASS ACTION LAW * REACTION ORDER 3.3.- THE RATE CONSTANT * DEFINITION * THE EFFECT OF TEMPERATURE 3.4.- HETEROGENEOUS REACTION KINETICS 4.- ELECTROCHEMICAL PROCESSES 4.1.- IONIC TRANSPORT IN SOLUTION 4.2.- ELECTRODE KINETICS * POLARIZATION AND OVERPOTENTIAL * TAFEL AND BUTLER-VOLMER EQUATIONS 4.3.- METAL OXIDATION KINETICS 5.- PHASE TRANSFORMATIONS 5.1.- MECHANISMS OF PHASE TRANSFORMATIONS 5.2.- NUCLEATION KINETICS 5.3.- GROWTH KINETICS 5.4.- AVRAMI-JOHNSON-MEHL EQUATION 5.5.- DIFFUSIONLESS TRANSFORMATIONS 6.- ELECTRICAL PROCESSES 6.1.- ELECTRONIC CONDUCTION IN SOLIDS 6.2.- BOLTZMANN EQUATION 7.- KINETICS OF DEFORMATION AND FRACTURE Reading Assignment: Askeland; Ch. 5, Secs. 7.8-7.10, 8.1-8.5, 9.9-9.11, 10.7, 11.4-11.5, 11.9-11.12, 20.5 Written Assignment: Two problems of your choice from each one of Chapters 5, 7, 8, 9, 10, 11, 20 36807 ENGINEERING MATERIALS LECTURE # 4 KINETIC PROCESSES IN MATERIALS ------------------------------ 1.- INTRODUCTION 1.1.- RATE PHENOMENA 1.2.- TRANSIENT, STEADY AND EQUILIBRIUM STATES 1.3.- TYPES OF RATE PROCESSES 2.- DIFFUSION PROCESSES 2.1.- DIFFUSION MECHANISMS 2.2.- THE DIFFUSION COEFFICIENT * ATOMIC JUMP DISTANCE AND JUMP FREQUENCY * DIFFUSION COEFFICIENT 2 D ~ * THE EFFECT OF TEMPERATURE D = D exp( - Q /RT) o D 2.3.- MACROSCOPIC ANALYSIS OF DIFFUSION * CONCENTRATION OF SUBSTANCE * DIFFUSIONAL FLUX J = - D grad C - * THE DIFFUSION EQUATION C = div ( D grad C ) t 2.4.- SOME SOLUTIONS OF THE DIFFUSION EQUATION * PENETRATION DEPTH 1/2 X ~ 2 ( D t ) * DIFFUSION INTO A SEMI-INFINITE SOLID 1/2 C(x,t) = C erfc( x/(2(Dt) ) ) s 3.- CHEMICAL REACTION PROCESSES 3.1.- REACTION MECHANISMS * RATE OF REACTION * ACTIVATED COMPLEX THEORY OF REACTION RATES * HOMOGENEOUS VS. HETEROGENEOUS REACTIONS 3.2.- BASIC LAW OF CHEMICAL KINETICS * MASS ACTION LAW For aA + bB + cC + ... ---> Products p q dC /dt = - k C C .... A A B * REACTION ORDER n = p + q + ... * ZERO, FIRST AND SECOND ORDER REACTIONS 504 C n = 1 ; CH COCH (g) -----> C H + CO + H 2 3 2 4 2 n = 2 ; 2NO ----> 2NO + O 2 2 3.3.- THE RATE CONSTANT * DEFINITION ( Specific Reaction Rate) * THE EFFECT OF TEMPERATURE (Arrhenius) k = k exp ( - Q /RT ) o k 3.4.- HETEROGENEOUS REACTION KINETICS * EXAMPLES TiCl + CH ---> TiC + 4HCl 4 4 FeO + CO ---> Fe + CO 2 Si + 2 H O ---> SiO + 2H 2 2 2 * INTERFACIAL REGION AS REACTION SITE * REACTION MECHANISM @ DIFFUSION OF REACTANTS TOWARDS INTERFACE @ ADSORPTION, REACTION PROPER, DESORPTION @ DIFFUSION OF PRODUCTS AWAY FROM INTERFACE 4.- ELECTROCHEMICAL PROCESSES 4.1.- FARADAY'S LAW (Steady State Conditions) m = M I t/(|z| F) 4.1.- IONIC TRANSPORT IN SOLUTION * MOLAR CONDUCTANCE ( of a ion in solution) = / C * DIFFUSION COEFFICIENT (of a ion in a solution) (Nernst) 2 D = (RT/F )( /|z|) 4.2.- ELECTRODE KINETICS * ELECTRICAL DOUBLE LAYER * POLARIZATION AND OVERPOTENTIAL * BUTLER-VOLMER AND TAFEL EQUATIONS i = i [ exp( F /RT) - exp( - F/RT) ] o * EXCHANGE CURRENT DENSITY AND TRANSFER COEFFICIENTS 4.3.- METAL OXIDATION KINETICS * MECHANISMS @ ELECTROCHEMICAL REACTION AT M/MO INTERFACE @ ELECTROCHEMICAL REACTION AT MO/O INTERFACE @ IONIC TRANSPORT INSIDE MO 2 * PARABOLIC LAW AND RATE CONSTANT 2 X = 2 k' t 5.- PHASE TRANSFORMATIONS 5.1.- CLASSIFICATION OF PHASE TRANSFORMATIONS * FLUID-FLUID (e.g. Condensation) * FLUID-SOLID (e.g. Sublimation, Solidification) * SOLID-SOLID @ DIFFUSIVE @ DISPLACIVE 5.2.- NUCLEATION KINETICS * HOMOGENEOUS VS. HETEROGENEOUS NUCLEATION * NUCLEATION RATE EQUATION I = I exp ( - Q /RT) o I 5.3.- GROWTH KINETICS U = U ( G) o 5.4.- AVRAMI-JOHNSON-MEHL EQUATION 3 f = 1 - exp( - I U t/3) 5.5.- DISPLACIVE TRANSFORMATIONS 6.- ELECTRICAL PROCESSES 6.1.- ELECTRONIC CONDUCTION IN SOLIDS 6.2.- BOLTZMANN EQUATION 7.- KINETICS OF DEFORMATION AND FRACTURE Reading Assignment: Askeland; Ch. 5, Secs. 7.8-7.10, 8.1-8.5, 9.9-9.11, 10.7, 11.4-11.5, 11.9-11.12, 20.5 Written Assignment: Two problems of your choice from each one of Chapters 5, 7, 8, 9, 10, 11, 20 HARTFORD GRADUATE CENTER SCHOOL OF ENGINEERING AND SCIENCE 36807 ENGINEERING MATERIALS PROF. GUTIERREZ-MIRAVETE LECTURE # 5 EXAM # 1 36807 ENGINEERING MATERIALS LECTURE # 6 PROPERTIES: MECHANICAL ---------------------- 1.- MECHANICAL PROPERTIES FOR ENGINEERING APPLICATIONS 1.1.- DEFORMATION PROPERTIES * ELASTIC * PLASTIC * CREEP * VISCOELASTIC 1.2.- RUPTURE PROPERTIES * LOW TEMPERATURE FRACTURE * HIGH TEMPERATURE FRACTURE * FATIGUE 2.- DEFORMATION AND FLOW PHENOMENA 2.1.- PHYSICAL PROCESSES IN DEFORMATION OF SOLIDS * YIELD STRENGTH OF A PERFECT CRYSTAL * CRYSTALLOGRAPHIC SLIP @ SLIP PLANES @ SLIP DIRECTIONS * SCHMID'S LAW @ CRITICAL RESOLVED SHEAR STRESS * DISLOCATION MOTION AND SLIP * DISLOCATION MULTIPLICATION * CONSTITUTIVE EQUATIONS FOR PLASTIC FLOW @ STRESS-STRAIN (POWER LAW) RELATIONSHIP @ STRESS-STRAIN RATE RELATIONSHIP * STRENGTHENING MECHANISMS @ WORK HARDENING @ GRAIN BOUNDARY HARDENING @ SOLID SOLUTION HARDENING @ PARTICLE HARDENING @ FIBER HARDENING * DEFORMATION MECHANISMS IN GLASSES AND ORGANIC POLYMERS @ ELASTIC DEFORMATION OF GLASS @ FLOW MECHANISMS IN POLYMERS & HOMOGENEOUS FLOW & SHEAR BAND FORMATION & CRAZING 2.2.- HIGH TEMPERATURE DEFORMATION * TIME-DEPENDENT DEFORMATION * VISCOUS FLOW IN GLASS * PHENOMENOLOGY OF CREEP @ PRIMARY, STEADY-STATE AND TERTIARY CREEP * CREEP MECHANISMS @ DISLOCATION GLIDE AND DIFFUSIONAL CREEP @ DEFORMATION MECHANISM MAPS * HOT WORKING PROCESSES @ DYNAMIC RECOVERY AND RECRYSTALLIZATION 3.- FRACTURE AND FATIGUE PHENOMENA 3.1.- THEORETICAL STRENGTH OF CRYSTALLINE SOLID 3.2.- LOW TEMPERATURE FRACTURE * "BRITTLE" FRACTURE MODES * DUCTILE FRACTURE * CHEMICAL BONDING AND FRACTURE MODE * CRACK NUCLEATION AND CRACK GROWTH * STRESS CONCENTRATION AT CRACK TIPS * GRIFFITH EQUATION FOR BRITTLE FRACTURE 3.2.- HIGH TEMPERATURE FRACTURE * RUPTURE * CREEP FRACTURE @ TRANSGRANULAR @ INTERGRANULAR * LIFE PREDICTION 3.3.- FATIGUE * SLOW AND FAST CRACK GROWTH AREAS IN FATIGUE FRACTURE * MATERIALS RESPONSE TO CYCLIC LOADING 4.- MECHANICAL TESTING OF MATERIALS 4.1.- TENSION TESTING 4.2.- HARDNESS TESTING 4.3.- CREEP TEST 4.4.- FRACTURE TEST 4.5.- FATIGUE TEST Reading Assignment: Askeland; Ch. 6, Ch. 7, Secs. 9.5, 10.2, 11.3, 11.4, 16.2 Ch. 21 Easterling; pp. 1-42 Written Assignment: Three problems of your choice from each one of Chapters 6, 7, 9, 10, 11, 16, 21 36807 ENGINEERING MATERIALS LECTURE # 7 PROPERTIES: ELECTRIC, MAGNETIC, OPTICAL, THERMAL ------------------------------------------------ 1.- NON-MECHANICAL PROPERTIES FOR ENGINEERING APPLICATIONS 2.- ELECTRICAL AND MAGNETIC PROPERTIES 2.1.- ELECTRICAL PROPERTIES * OHM'S LAW AND CONDUCTIVITY * ELECTRONIC STRUCTURE OF SOLIDS * EFFECT OF ATOMIC ARRANGEMENT ON THE ELECTRICAL CONDUCTIVITY OF METALS * ENERGY BAND GAPS: SEMICONDUCTORS * INSULATORS 2.2.- MAGNETIC PROPERTIES * MAGNETIC POLARIZATION * MAGNETIC FIELD AND MAGNETIC FLUX DENSITY * TYPES OF MAGNETIC BEHAVIOR (IN B-H CURVES) * DOMAIN PHENOMENA IN FERROMAGNETIZATION 3.- OPTICAL PROPERTIES * ENERGY, WAVELENGTH, AND FREQUENCY OF PHOTONS * RADIATION SPECTRA * EMISSION PHENOMENA * PHOTON-MATERIAL INTERACTIONS 4.- THERMAL PROPERTIES * ENERGY, WAVELENGTH, AND FREQUENCY OF PHONONS * HEAT CAPACITY AND SPECIFIC HEAT * THERMAL EXPANSION * THERMAL CONDUCTIVITY Reading Assignment: Part IV, Ch. 17-19, Askeland Written Assignment: Five problems of your choice from each one of Chapters 17, 18, 19 36807 ENGINEERING MATERIALS LECTURE # 7 PROPERTIES: ELECTRIC, MAGNETIC, OPTICAL, THERMAL ------------------------------------------------ 1.- NON-MECHANICAL PROPERTIES FOR ENGINEERING APPLICATIONS 2.- ELECTRICAL AND MAGNETIC PROPERTIES 2.1.- ELECTRICAL PROPERTIES * OHM'S LAW AND CONDUCTIVITY @ RESISTANCE @ RESISTIVITY @ CONDUCTIVITY @ CURRENT DENSITY @ ELECTRIC FIELD @ MOBILITY @ CHARGE CARRIERS IN MATERIALS @ CONDUCTIVITY AND DIFFUSIVITY IN IONIC SOLIDS * ELECTRONIC STRUCTURE OF SOLIDS @ FREE ELECTRON MODEL FOR METALS @ BOUND ELECTRON MODEL FOR INSULATORS @ BAND MODEL: CONDUCTORS, INSULATORS AND SEMI- CONDUCTORS * EFFECT OF ATOMIC ARRANGEMENT ON THE ELECTRICAL CONDUCTIVITY OF METALS @ ATOMIC VIBRATIONS AND RESISTIVITY @ POINT DEFECTS AND RESISTIVITY @ LINEAR AND PLANAR DEFECTS AND RESISTIVITY @ SECOND PHASES AND RESISTIVITY * ENERGY BAND GAPS: SEMICONDUCTORS @ GAP SIZE AND RESISTIVITY @ ELECTRONS AND HOLES IN SEMICONDUCTORS @ INTRINSIC SEMICONDUCTION @ EXTRINSIC SEMICONDUCTION # N-TYPE # P-TYPE # COMPOUND SEMICONDUCTORS @ P-N JUNCTION * INSULATORS @ ELECTRICAL POLARIZATION @ CAPACITANCE @ PERMITTIVITY AND DIELECTRIC CONSTANT @ DIELECTRIC STRENGTH AND DIELECTRIC LOSS @ POLARIZATION AND ELECTROSTRICTION @ POLARIZATION AND FERROELECTRICITY 2.2.- MAGNETIC PROPERTIES * MAGNETIC POLARIZATION @ MAGNETIC MOMENT OF AN ELECTRON IN AN ATOM @ UNPAIRED ELECTRONS AND NET MAGNETIC MOMENT @ EXCHANGE INTERACTION (MUTUAL REINFORCEMENT) PHENOMENA * MAGNETIC FIELD AND MAGNETIC FLUX DENSITY @ MAGNETICX PERMEABILITY @ MAGNETIZATION @ MAGNETIC SUCEPTIBILITY * TYPES OF MAGNETIC BEHAVIOR (IN B-H CURVES) @ DIAMAGNETISM @ PARAMAGNETISM @ ANTIFERROMAGNETISM @ FERRIMAGNETISM @ FERROMAGNETISM * DOMAIN PHENOMENA IN FERROMAGNETIZATION @ MAGNETIC DOMAINS AND BLOCH WALLS @ MAGNETIZATION AND WALL MOTION @ SATURATION MAGNETIZATION @ COERCIVE FIELD @ HYSTERESIS LOOP @ MAGNETOSTRICTION 3.- OPTICAL PROPERTIES * ENERGY, WAVELENGTH, AND FREQUENCY OF PHOTONS * RADIATION SPECTRA @ CONTINUOUS @ CHARACTERISTIC * EMISSION PHENOMENA @ X-RAYS @ LUMINESCENCE @ THERMAL EMISSION * PHOTON-MATERIAL INTERACTIONS @ ABSORPTION AND TRANSMISSION @ REFRACTION @ REFLECTION @ SELECTIVE ABSORPTION, TRANSMISSION AND REFLECTION @ PHOTOCONDUCTION 4.- THERMAL PROPERTIES * ENERGY, WAVELENGTH, AND FREQUENCY OF PHONONS * HEAT CAPACITY AND SPECIFIC HEAT * THERMAL EXPANSION * THERMAL CONDUCTIVITY @ THERMAL ENERGY CONDUCTION IN METALS @ THERMAL ENERGY CONDUCTION IN NON-METALS Reading Assignment: Part IV, Ch. 17-19, Askeland Written Assignment: Five problems of your choice from each one of Chapters 17, 18, 19 36807 ENGINEERING MATERIALS LECTURE # 8 PROPERTIES: CHEMICAL -------------------- 1.- INTRODUCTION TO CHEMICAL REACTIVITY 1.1.- LAW OF CHEMICAL EQUILIBRIUM 1.2.- GIBBS FREE ENERGY CHANGE IN A CHEMICAL REACTION AS DRIVING FORCE 1.3.- CONDITION FOR CHEMICAL EQUILIBRIUM 1.4.- REACTION RATES 2.- LOW TEMPERATURE (WET) CORROSION 2.1.- WHAT IS CORROSION? 2.2.- FORMS OF CORROSION * UNIFORM ATTACK * LOCALIZED ATTACK * ASSISTED ATTACK 2.2.- CHEMISTRY AND ELECTROCHEMISTRY OF CORROSION * OXIDATION AND REDUCTION * CONCENTRATION AND ACTIVITY * ACIDITY AND pH * THE ELECTROCHEMICAL POTENTIAL * ELECTROCHEMICAL CELLS AND HALF-CELLS 2.3.- WHY CORROSION HAPPENS AND HOW FAST? * DRIVING FORCE FOR CORROSION * ELECTRICAL DOUBLE LAYER FORMATION * OVERPOTENTIAL * MIXED POTENTIAL AND CORROSION POTENTIAL * THE EXCHANGE CURRENT DENSITY * ANODIC AND CATHODIC CURRENT DENSITIES (POLARIZATION) * CURRENT-POTENTIAL RELATIONSHIP * CURRENT DENSITY AND RATE OF METAL WASTAGE * OTHER TYPES OF POLARIZATION 2.4.- CORROSION CONTROL 3.- HIGH TEMPERATURE (DRY) CORROSION 3.1.- DRIVING FORCE FOR DRY CORROSION 3.2.- MECHANISMS OF OXIDATION * DIFFUSIONAL TRANSPORT OF IONS AND ELECTRONS IN IONIC SOLIDS * NON-STOICHIOMETRIC IONIC COMPOUNDS * RATE OF DIFFUSION CONTROLLED OXIDE FORMATION 3.3.- SOME COMPLICATING FACTORS * PURE METALS * ALLOYS * MIXED ATMOSPHERES 4.- OTHER REACTING SYSTEMS 4.1.- ENVIRONMENTAL BEHAVIOR OF PLASTICS * SOLUBILITY * CROSSLINKING EFFECTS * WATER ABSORPTION 4.1.- THIN SOLID FILMS: AN EXAMPLE, THE AU-AL SYSTEM * THIN AU ON AL: AU2AL ---> AUAL2 * THIN AL ON AU: AU2AL ---> AU5AL2 ---> AU4AL Reading Assignment: Askeland, Ch. 20; Secs. 14.9; 15.7 36807 ENGINEERING MATERIALS LECTURE # 8 PROPERTIES: CHEMICAL -------------------- 1.- INTRODUCTION TO CHEMICAL REACTIVITY 1.1.- LAW OF CHEMICAL EQUILIBRIUM 1.2.- GIBBS FREE ENERGY CHANGE IN A CHEMICAL REACTION AS DRIVING FORCE * ELLINGHAM DIAGRAMS * POTENTIAL-pH DIAGRAMS * STABILITY DIAGRAMS 1.3.- CONDITION FOR CHEMICAL EQUILIBRIUM 1.4.- REACTION RATES 2.- LOW TEMPERATURE (WET) CORROSION 2.1.- WHAT IS CORROSION? 2.2.- FORMS OF CORROSION * UNIFORM ATTACK * LOCALIZED ATTACK @ CREVICE ATTACK @ BIMETALLIC CORROSION @ GRAIN BOUNDARY ATTACK @ PITTING ATTACK * ASSISTED ATTACK @ STRESS CORROSION @ EROSION CORROSION @ CORROSION FATIGUE @ HYDROGEN EMBRITTLEMENT 2.2.- CHEMISTRY AND ELECTROCHEMISTRY OF CORROSION * OXIDATION AND REDUCTION * CONCENTRATION AND ACTIVITY * ACIDITY AND pH * THE ELECTROCHEMICAL POTENTIAL * ELECTROCHEMICAL CELLS AND HALF-CELLS @ ELECTRICAL AND CHEMICAL POTENTIAL DIFFERENCES @ SINGLE POTENTIALS @ NERNST EQUATION AND STANDARD SINGLE POTENTIALS @ EFFECT OF COMPLEXANTS ON SINGLE POTENTIAL 2.3.- WHY CORROSION HAPPENS AND HOW FAST? * DRIVING FORCE FOR CORROSION * ELECTRICAL DOUBLE LAYER FORMATION * OVERPOTENTIAL @ CREATION OF OVERPOTENTIAL BY CONNECTION TO ELECTRON SINK @ CREATION OF OVERPOTENTIAL BY ADDITION OF OXIDISING AGENT * MIXED POTENTIAL AND CORROSION POTENTIAL * THE EXCHANGE CURRENT DENSITY * ANODIC AND CATHODIC CURRENT DENSITIES (POLARIZATION) * CURRENT-POTENTIAL RELATIONSHIP @ TAFEL EQUATION @ EVANS DIAGRAM ( E vs log i ) * CURRENT DENSITY AND RATE OF METAL WASTAGE * OTHER TYPES OF POLARIZATION 2.4.- CORROSION CONTROL 3.- HIGH TEMPERATURE (DRY) CORROSION 3.1.- DRIVING FORCE FOR DRY CORROSION 3.2.- MECHANISMS OF OXIDATION * DIFFUSIONAL TRANSPORT OF IONS AND ELECTRONS IN IONIC SOLIDS * NON-STOICHIOMETRIC IONIC COMPOUNDS * RATE OF DIFFUSION CONTROLLED OXIDE FORMATION @ THE PARABOLIC LAW @ OTHER RATE LAWS 3.3.- SOME COMPLICATING FACTORS * PURE METALS @ SAMPLE GEOMETRY @ MULTILAYER FORMATION & FE-O SYSTEM * ALLOYS @ INTERNAL AND EXTERNAL OXIDATION & PT-NI SYSTEM VS CU-TI SYSTEM & NI-CR SYSTEM * MIXED ATMOSPHERES 4.- OTHER REACTING SYSTEMS 4.1.- ENVIRONMENTAL BEHAVIOR OF PLASTICS * SOLUBILITY * CROSSLINKING EFFECTS * WATER ABSORPTION 4.1.- THIN SOLID FILMS: AN EXAMPLE, THE AU-AL SYSTEM * THIN AU ON AL: AU2AL ---> AUAL2 * THIN AL ON AU: AU2AL ---> AU5AL2 ---> AU4AL Reading Assignment: Askeland, Ch. 20; Secs. 14.9; 15.7 HARTFORD GRADUATE CENTER SCHOOL OF ENGINEERING AND SCIENCE 36807 ENGINEERING MATERIALS PROF. GUTIERREZ-MIRAVETE LECTURE # 9 EXAM # 2 36807 ENGINEERING MATERIALS LECTURE # 10 METALLICS: METALS AND ALLOYS ---------------------------- 1.- CLASSIFICATION OF METALS AND ALLOYS 1.1.- FERROUS ALLOYS 1.2.- HIGH TEMPERATURE ALLOYS 1.3.- LIGHT METAL ALLOYS 1.4.- HEAVY METAL ALLOYS 1.5.- TOOL MATERIALS 1.6.- INTERMETALLICS 2.- METALS PROCESSING 2.1.- FROM THE MOLTEN STATE 2.2.- FROM THE SOLID STATE Reading Assignment: Askeland: Ch. 12 and 13 Easterling: pp. 43-59, 73-76 Written Assignment: Read through the end of chapter problems for Chs. 12 and 13 of Askeland. Attempt the solution of as many problems of your choice as you wish. 36807 ENGINEERING MATERIALS LECTURE # 11 NONMETALLICS: SEMICONDUCTORS, CERAMICS AND GLASSES -------------------------------------------------- 1.- CLASSIFICATION OF NONMETALLIC MATERIALS 2.- SEMICONDUCTORS 2.1.- CLASSIFICATION OF SEMICONDUCTORS * ELEMENTAL (Si; Ge) * COMPOUND ( III-V; II-VI; IV-VI) * BASIC SEMICONDUCTOR DEVICES 2.2.- SEMICONDUCTOR PROCESSING * CRYSTAL GROWTH AND EPITAXY * OXIDATION AND FILM DEPOSITION * DIFFUSION AND ION IMPLANTATION * LITHOGRAPHY AND ETCHING * PACKAGING 3.- CERAMICS 3.1.- INTRODUCTION * CLASSIFICATION OF CERAMICS * CERAMIC PROCESSING STAGES * STUDY AREAS 3.2.- CERAMIC PROCESSING * POWDER MANUFACTURE: FROM SOLUTION, FROM VAPOR PHASE, FROM SOLID BY GRINDING * FIBRE MANUFACTURE: MELT SPINNING, EXTRUSION, CRYSTALLIZATION (FROM SOLUTION OR VAPOR) * GREENBODY FORMING * TRANSFORMATION TO FINAL SHAPE * SURFACE FINISHING 4.- GLASSES 4.1.- DEFINITION AND CLASSIFICATION OF GLASSES * GLASS AS A SUPERCOOLED MELT * CLASSIFICATION OF GLASSES 4.2.- GLASS PROCESSING * MIX PRODUCTION * GLASS FORMATION FROM THE GAS, MELT OR SOLID * FUSION, REFINING AND VISCOSITY ADJUSTMENT OF GLASS * FORMING OF GLASS Reading Assignment: Askeland; Sec. 17.10, 17.11, Ch. 14 Easterling; pp. 76-118 Written Assignment: Read through the end of chapter problems for Chs. 14 and 17 of Askeland. Attempt the solution of as many problems of your choice as you wish. 36807 ENGINEERING MATERIALS LECTURE # 11 NONMETALLICS: SEMICONDUCTORS, CERAMICS AND GLASSES -------------------------------------------------- 1.- CLASSIFICATION OF NONMETALLIC MATERIALS 2.- SEMICONDUCTORS 2.1.- CLASSIFICATION OF SEMICONDUCTORS * ELEMENTAL (Si; Ge) D structure * COMPOUND @ III-V (GaAs; InP; AlSb) S structure @ II-VI (CdS; ZnS; HgTe +CdTe) S & W " @ IV-VI (PbSe; SnTe) NaCl " 2.2.- BASIC SEMICONDUCTOR DEVICES * THE P-N JUNCTION @ EQUILIBRIUM JUNCTION AND DEPLETION REGION @ FORWARD AND BACKWARD BIASING * BIPOLAR DEVICES: THE TRANSISTOR @ P+-N-P (EMITTER-BASE-COLLECTOR) @ EQUILIBRIUM JUNCTIONS AND DEPLETION REGIONS @ ACTIVE MODE OPERATION (P+-N FOR; N-P BACK) WITH COMMON (GROUNDED) BASE CONFIGURATION @ TRANSISTOR ACTION * UNIPOLAR DEVICES (FIELD EFFECT TRANSISTORS) @ MOS DIODE (METAL/OXIDE/P-DOPED SI) & ACCUMULATION, DEPLETION, INVERSION (WITH V) @ OTHERS (JFET; MESFET; MOSFET) * MICROWAVE DEVICES @ IMPATT DIODE @ BARITT DIODE * PHOTONIC DEVICES @ LED (GaAs)) @ SEMICONDUCTOR LASER (III-V; AlGaAsSb) @ PHOTODETECTORS (III-V; GaInAs) @ SOLAR CELLS 2.3.- SEMICONDUCTOR PROCESSING * CRYSTAL GROWTH AND EPITAXY @ CZOCHRALSKI TECHNIQUE @ BRIDGMAN TECHNIQUE @ FLOATING ZONE METHOD @ VAPOR-PHASE EPITAXY @ LIQUID PHASE EPITAXY @ MOLECULAR BEAM EPITAXY * OXIDATION AND FILM DEPOSITION @ THERMAL OXIDATION @ DIELECTRIC DEPOSITION (CVD) @ POLYSILICON DEPOSITION @ METALLIZATION (PVD & CVD) * DIFFUSION AND ION IMPLANTATION * LITHOGRAPHY AND ETCHING * PACKAGING 3.- CERAMICS 3.1.- INTRODUCTION * CLASSIFICATION OF CERAMICS @ TRADITIONAL CERAMICS @ HIGH PERFORMANCE CERAMICS * CERAMIC PROCESSING STAGES @ RAW MATERIALS PREPARATION @ GREEN FORMING @ HIGH TEMPERATURE CONSOLIDATION @ FINISHING * STUDY AREAS @ CRYSTALLINE DEFECTS @ INTERFACIAL PHENOMENA @ KINETIC PROCESSES 3.2.- CERAMIC PROCESSING * POWDER MANUFACTURE @ FROM SOLUTION & SPRAY DRYING (MgO, Al2O3; MgCr2O4) & FREEZE DRYING (BaTiO3) & PRECIPITATION (MgAl2O4) & SOL-GEL (BaFe2O4; ThO2) @ FROM VAPOR PHASE & SiC; WC; Si3N4 @ FROM SOLID BY GRINDING * FIBRE MANUFACTURE @ MELT SPINNING (Al203-SiO2) @ EXTRUSION (SOL-GEL) (ZrO2; Al2O3) @ CRYSTALLIZATION (FROM SOLUTION OR VAPOR) ON SUBSTRATE (SiC) * GREENBODY FORMING @ GREEN STRENGTH @ POWDER COMPACTION [KAWAKITA: C = aP/(1+bP) ] @ UNIAXIAL PRESSING: STRESS & DENSITY GRADIENTS @ ISOSTATIC PRESSING @ SLIP CASTING (SI3N4; ZRSIO4; b-Al2O3) @ SOL-GEL FORMING @ INJECTION MOLDING (SiC) @ WEAVING (ZrO2) * TRANSFORMATION TO FINAL SHAPE @ CERAMIC SINTERING @ STAGES OF SINTERING @ SINTERING PROCESSES & SOLID STATE SINTERING & LIQUID PHASE SINTERING [SICALONS (SiC/AlN/Al2OC) ] & VISCOUS FLOW SINTERING @ HOT ISOSTATIC PRESSING (BaTiO3; Y3Fe5O12) @ SELF-PROPAGATING HIGH TEMPERATURE SYNTHESIS (SHS) [TiN; MoSi2] @ COATINGS BY CVD * SURFACE FINISHING @ GRINDING @ EROSION AND WEAR SHAPING @ COATING FABRICATION 4.- GLASSES 4.1.- DEFINITION AND CLASSIFICATION OF GLASSES * GLASS AS A SUPERCOOLED MELT * CLASSIFICATION OF GLASSES @ NATURAL @ ARTIFICIAL & OXIDE GLASSES $ NETWORK FORMING, ONE COMPONENT (SiO2) $ NETWORK FORMING, MULTI-COMPONENT (SiO2-B2O3; SiO2-P2O5) $ NETWORK AND NON-NETWORK FORMING, MULTI-COMPONENT (SiO2-Na2O-CaO) & HALOGEN GLASSES (BeF2) & CHALCOGENIDE GLASSES ( V-VI GROUPS) & METALLIC GLASSES $ METAL-METALLOID (Fe-B) $ METAL-METAL (Zr50Cu50) 4.2.- GLASS PROCESSING * MIX PRODUCTION @ NETWORK FORMING OXIDES @ NETWORK MODIFYING OXIDES @ SECONDARY CONSTITUENTS * GLASS FORMATION FROM THE GAS, MELT OR SOLID * FUSION, REFINING AND VISCOSITY ADJUSTMENT OF GLASS @ CERAMIC CRUCIBLE FURNACES @ Pt-CRUCIBLE FURNACE @ CONTINUOUS FURNACES & FLAT PLATES & PARISONS * FORMING OF GLASS @ CONTINUOS CASTING OF FLAT PLATES @ PULLING OF FLAT PLATES @ FLOAT GLASS PROCESS @ HOLLOW GLASS BY PRESSING AND BLOWING @ GLASS FIBRE FORMATION & STRETCHING & CENTRIFUGAL & FROM THE MELT Reading Assignment: Askeland; Sec. 17.10, 17.11, Ch. 14 Easterling; pp. 76-118 Written Assignment: Read through the end of chapter problems for Chs. 14 and 17 of Askeland. Attempt the solution of as many problems of your choice as you wish. 36807 ENGINEERING MATERIALS LECTURE # 12 ORGANIC POLYMERS ---------------- 1.- ORGANIC POLYMERS 1.1.- CLASSIFICATION BASED ON POLYMERIZATION MECHANISM * ADDITION POLYMERS * CONDENSATION POLYMERS * COPOLYMERIZATION 1.2.- CLASSIFICATION BASED ON STRUCTURE * LINEAR CHAIN POLYMERS * NETWORK (CROSS-LINKED) POLYMERS * COPOLYMERS (RANDON, BLOCK, GRAFT) * CRYSTALLINE/AMORPHOUS POLYMERS 1.3.- CLASSIFICATION BASED ON POLYMER BEHAVIOR * THERMOPLASTIC POLYMERS (TABLES 15.6, 15.7) * THERMOSETTING POLYMERS (TABLE 15.9) * ELASTOMERS (TABLE 15.8) 1.4.- SIZE DISTRIBUTION OF POLYMER MOLECULES * EFFECT OF MOLECULE SIZE ON PROPERTIES * DEGREE OF POLYMERIZATION * RELATIVE MOLECULAR MASS * WEIGHT AVERAGE AND NUMBER AVERAGE MOLECULAR WEIGHTS 2.- POLYMER PROCESSING 2.1.- PHYSICAL BASIS * THERMOPLASTICS VS. THERMOSETS * POLYMER RHEOLOGY * HEAT TRANSFER * ADDITIVES 2.1.- POLYMER PROCESSING OPERATIONS * MIXING * EXTRUSION * BLOW MOLDING * INJECTION MOLDING * THERMOFORMING * COMPRESSION AND TRANSFER MOLDING * RUBBER PROCESSING Reading Assignment: Askeland; Ch. 15 Written Assignment: Read through the end of chapter problems for Ch. 15 Askeland. Attempt the solution of as many problems of your choice as you wish. 36807 ENGINEERING MATERIALS LECTURE # 12 ORGANIC POLYMERS ---------------- 1.- ORGANIC POLYMERS 1.1.- CLASSIFICATION BASED ON POLYMERIZATION MECHANISM * ADDITION POLYMERS & POLYETHYLENE & VINYL POLYMERS + POLYPROPYLENE + POLYSTYRENE + POLYVINYL CHLORIDE & SIDE BRANCHING BY "BACK-BITING" * CONDENSATION POLYMERS & HEXAMETHYLENE DIAMINE + ADIPIC ACID ---> NYLON 6.6 (POLYAMIDE) & ETHYLENE GLYCOL + TEREPHTHALIC ACID ---> POLYETHYLENE TEREPHTHALATE (POLYESTER) * COPOLYMERIZATION & ACRYLONITRILE-BUTADIENE-STYRENE (ABS) 1.2.- CLASSIFICATION BASED ON STRUCTURE * LINEAR CHAIN POLYMERS * NETWORK (CROSS-LINKED) POLYMERS * COPOLYMERS (RANDON, BLOCK, GRAFT) * CRYSTALLINE/AMORPHOUS POLYMERS 1.3.- CLASSIFICATION BASED ON POLYMER BEHAVIOR * THERMOPLASTIC POLYMERS (TABLES 15.6, 15.7) * THERMOSETTING POLYMERS (TABLE 15.9) & PHENOL + FORMALDEHYDE ---> RESOLE PHENOLIC & UREA + FORMALDEHYDE ---> AMINO RESIN & ADIPIC ACID + ETHYLENE GLYCOL + MALEIC ACID ---> POLYESTER & EPOXIES & POLYMIDES * ELASTOMERS (TABLE 15.8) 1.4.- SIZE DISTRIBUTION OF POLYMER MOLECULES * EFFECT OF MOLECULE SIZE ON PROPERTIES * DEGREE OF POLYMERIZATION * RELATIVE MOLECULAR MASS * WEIGHT AVERAGE AND NUMBER AVERAGE MOLECULAR WEIGHTS 1.5.- DEFORMATION MECHANISMS IN ORGANIC POLYMERS 2.- POLYMER PROCESSING 2.1.- PHYSICAL BASIS * THERMOPLASTICS VS. THERMOSETS * POLYMER RHEOLOGY & NEWTONIAN BEHAVIOR & SHEAR RATES AND SHEAR STRESSES IN FORMING OPERATIONS & NON-NEWTONIAN BEHAVIOR + PSEUDO-PLASTIC FLUIDS + APPARENT VISCOSITY + POWER LAW FLUIDS + EFFECT OF TEMPERATURE & FLOW IN CHANNELS + POISEUILLE' EQUATION + PRESSURE REQUIRED TO DRIVE FLOW & MELT FLOW INDEX * HEAT TRANSFER & MELTING OF THERMOPLASTICS + EXTERNAL HEATING + VISCOUS HEATING & SOLIDIFICATION BY CHEMICAL CHANGE (CURING) & SOLIDIFICATION BY PHYSICAL CHANGE (FREEZING) & COOLING OF MOLDINGS * ADDITIVES 2.1.- POLYMER PROCESSING OPERATIONS * MIXING & DISTRIBUTIVE (EXTENSIVE) MIXING & DISPERSIVE (INTENSIVE) MIXING & BLENDERS + TUMBLERS + RIBBON BLENDER + HIGH SPEED MIXER + Z-BLADE MIXER & COMPOUNDERS + TWO-ROLL MILL + BANBURY * EXTRUSION & SCREW EXTRUDER & EXTRUDER ZONES + FEED, COMPRESSION, METERING, DIE * BLOW MOLDING * INJECTION MOLDING * THERMOFORMING & VACUUM FORMING * COMPRESSION AND TRANSFER MOLDING * RUBBER PROCESSING & CALENDERING Reading Assignment: Askeland; Ch. 15 Written Assignment: Read through the end of chapter problems for Ch. 15 Askeland. Attempt the solution of as many problems of your choice as you wish. 36807 ENGINEERING MATERIALS LECTURE # 13 COMPOSITE MATERIALS ------------------- 1.- COMPOSITE MATERIALS 1.1.- THE COMPOSITE EFFECT 1.2.- CLASSIFICATION OF COMPOSITES * BASED ON THE NATURE OF THE MATRIX * BASED ON GEOMETRY OF REINFORCEMENT 1.3.- FIBERS: FABRICATION AND STRUCTURE * INTRODUCTION * ELEMENTAL FIBERS * CERAMIC FIBERS * ORGANIC FIBERS * METALLIC FIBERS 1.4.- MATRIX MATERIALS * ORGANIC POLYMERS * METALLIC * CERAMIC 1.5.- THE FIBER-MATRIX INTERFACE * FIBER-MATRIX INTERACTIONS * FIBER-MATRIX BONDING 2.- COMPOSITES MATERIALS PROCESSING 2.1.- POLYMER MATRIX COMPOSITES * PROCESSING STAGES * DISCRETE COMPONENTS * CONTINUOUS PRODUCT 2.2.- METAL MATRIX COMPOSITES * SOLID STATE PROCESSES * LIQUID STATE PROCESSING * IN SITU PROCESSING 2.3.- CERAMIC MATRIX COMPOSITES * PROCESSING STAGES * REINFORCEMENT INCORPORATION PROCESSES * CONSOLIDATION 2.4.- CARBON FIBER COMPOSITES Reading Assignment: Askeland; Ch. 16 Easterling; pp. 60-70, 119-139 Written Assignment: Read through the end of chapter problems for Ch. 16 Askeland. Attempt the solution of as many problems of your choice as you wish. 36807 ENGINEERING MATERIALS LECTURE # 13 COMPOSITE MATERIALS ------------------- 1.- COMPOSITE MATERIALS 1.1.- THE COMPOSITE EFFECT 1.2.- CLASSIFICATION OF COMPOSITES * BASED ON THE NATURE OF THE MATRIX + POLYMER MATRIX COMPOSITES + METAL MATRIX COMPOSITES + CERAMIC MATRIX COMPOSITES * BASED ON GEOMETRY OF REINFORCEMENT + PARTICLE REINFORCED COMPOSITES + DISCONTINUOUS FIBER REINFORCED COMPOSITES + CONTINUOUS FIBER REINFORCED COMPOSITES 1.3.- FIBERS: FABRICATION AND STRUCTURE * INTRODUCTION * ELEMENTAL FIBERS + CARBON [TURBOSTRATIC GRAPHITE] & FROM POLYACRYLONITRILE PRECURSOR + BORON [MICROCRYSTALLINE] & BY CVD FROM HALIDE ON SUBSTRATE * CERAMIC FIBERS + GLASS [E-GLASS] & BY MELT SPINNING & BY SOL-GEL PROCESS + ALUMINA & BY SOL-GEL PROCESS (NEXTEL 312) & BY PYROLISIS OF POLYMER PRECURSOR (SAFILL) + SILICON CARBIDE & BY CVD FROM METYLTRICHLOROSILANE ON SUBSTRATE (SCS) & BY PYROLISIS OF POLYMER PRECURSOR (NICALON) & WHISKERS BY VAPOR PHASE GROWTH FROM RICE HULLS * ORGANIC FIBERS + ORIENTED POLYETHYLENE (ALLIED CO.) + ARAMIDS & POLY-PARA-PHENILENETHEREFTALAMIDE [KEVLAR] (DU PONT) * METALLIC FIBERS + TAYLOR PROCESS + MELT SPINNING 1.4.- MATRIX MATERIALS * ORGANIC POLYMERS + THERMOSETS & POLYESTER RESINS (UNSATURATED BACKBONE + REACTIVE MONOMER) & EPOXY RESINS (DGEBPA) & POLYMIDES AND POLYBENZIMIDAZOLES (PBI) + THERMOPLASTICS & CONVENTIONAL (POLYETHYLENE) & ENGINEERING (ABS) & HIGH PERFORMANCE (PEEK) * METALLIC + LIGHT METAL ALLOYS (AL; MG) + COPPER + OTHER * CERAMIC + OXIDES (AL2O3; ZR02) + GLASS (LI2O-AL2O3-SIO2; MGO-AL2O3-SIO2) + OTHER (BA-SI-AL-O-N) 1.5.- THE FIBER-MATRIX INTERFACE * FIBER-MATRIX INTERACTIONS * FIBER-MATRIX BONDING + MECHANICAL + CHEMICAL 2.- COMPOSITES MATERIALS PROCESSING 2.1.- POLYMER MATRIX COMPOSITES * PROCESSING STAGES + SHAPING + CURING AND BONDING * DISCRETE COMPONENTS + MANUAL LAY-UP & WET & PREPREG + SPRAY-UP + AUTOMATED TAPE LAY-DOWN + VACUUM BAGGING + FILAMENT WINDING + MATCHED-DIE MOLDING + RESIN-TRANSFER MOLDING * CONTINUOUS PRODUCT + PULTRUSION 2.2.- METAL MATRIX COMPOSITES * SOLID STATE PROCESSES + DIFFUSION BONDING ( B/AL COMPOSITES) + POWDER METALLURGY (SIC/AL COMPOSITES) + MECHANICAL ALLOYING (123 SUPERCONDUCTOR PRECURSORS) + PLASMA SPRAYING + HOT PRESSING (NI-SUPERALLOY WITH AL2O3) * LIQUID STATE PROCESSING + SQUEEZE CASTING (AL2O3/AL COMPOSITES) + SPRAY FORMING (AL; CU; NI; FE ALLOYS) * IN SITU PROCESSING + DIRECTIONAL SOLIDIFICATION (EUTECTICS) 2.3.- CERAMIC MATRIX COMPOSITES * PROCESSING STAGES + REINFORCEMENT INCORPORATION + CONSOLIDATION * REINFORCEMENT INCORPORATION PROCESSES + SLURRY INFILTRATION + IN SITU CHEMICAL REACTION & CHEMICAL VAPOR INFILTRATION & CHEMICAL VAPOR DEPOSITION & REACTION BONDING + MELT INFILTRATION + SOL-GEL METHODS + POLYMER PYROLISIS + POWDER MIXING * CONSOLIDATION + HOT PRESSING + SINTERING 2.4.- CARBON FIBER COMPOSITES Reading Assignment: Askeland; Ch. 16 Easterling; pp. 60-70, 119-139 Written Assignment: Read through the end of chapter problems for Ch. 16 Askeland. Attempt the solution of as many problems of your choice as you wish. 36807 ENGINEERING MATERIALS LECTURE # 14 COMPOSITE MATERIALS (CONTD.) ---------------------------- 1.- WOOD 1.1.- CLASSIFICATION * HARDWOODS (ANGIOSPERMS; DECIDUOUS) + APPLE, BAMBOO, BIRCH, EBONY, ELM, MAHOGANY, OAK (RED AND WHITE) * SOFTWOODS (GYMNOSPERMS; EVERGREEN) + PINE, FIR, SPRUCE 1.2.- STRUCTURE * GENERAL + AXIAL, RADIAL AND TANGENTIAL DIRECTIONS IN A TREE TRUNK + CROSS SECTION * HARDWOODS + FIBERS (LONGITUDINAL CELLS FOR SUPPORT) + RAYS (PARENCHYMA CELLS FOR FOOD STORAGE) + SAP CHANNELS (VESSELS; FOR FLUID CONDUCTION) * SOFTWOODS + TRACHEIDS (LONGITUDINAL CELLS FOR SUPPORT) + RAYS (PARENCHYMA CELLS FOR FOOD STORAGE) + LUMEN (PORE SPACE IN TRACHEIDS; FOR FLUID CONDUCTION) * WOOD CELL WALLS + CELLULOSE MICROFIBRILS (CRYSTALLINE REINFORCEMENT) [ ~ 45%] + HEMICELLULOSE (PARTIALLY CRYSTALLINE) & LIGNIN (AMORPHOUS) MATRIX [~ 40%] + WATER AND EXTRACTIVES (OILS & SALTS) * RELATION WITH MECHANICAL PROPERTIES + ANISOTROPY OF PROPERTIES + THE ROLE OF DENSITY + DEFORMATION BEHAVIOR (VISCOELASTIC --> ELASTIC) + FRACTURE BEHAVIOR Reading Assignemnt: Askeland; pp. 612-618 36807 ENGINEERING MATERIALS LECTURE # 14 COMPOSITE MATERIALS (CONTD.) ---------------------------- 1.- WOOD 1.1.- CLASSIFICATION * HARDWOODS (ANGIOSPERMS; DECIDUOUS) + APPLE, BAMBOO, BIRCH, EBONY, ELM, MAHOGANY, OAK (RED AND WHITE) * SOFTWOODS (GYMNOSPERMS; EVERGREEN) + PINE, FIR, SPRUCE 1.2.- STRUCTURE * GENERAL + AXIAL, RADIAL AND TANGENTIAL DIRECTIONS IN A TREE TRUNK + CROSS SECTION & RAYS AND GROWTH RINGS & SUBRINGS & BARK, SAPWOOD AND HEARTHWOOD * HARDWOODS + FIBERS (LONGITUDINAL CELLS FOR SUPPORT) + RAYS (PARENCHYMA CELLS FOR FOOD STORAGE) + SAP CHANNELS (VESSELS; FOR FLUID CONDUCTION) & RING-POROUS (ELM) VS. DIFFUSE-POROUS (MAPLE) HARDWOODS * SOFTWOODS + TRACHEIDS (LONGITUDINAL CELLS FOR SUPPORT) + RAYS (PARENCHYMA CELLS FOR FOOD STORAGE) + LUMEN (PORE SPACE IN TRACHEIDS; FOR FLUID CONDUCTION) * WOOD CELL WALLS + CELLULOSE MICROFIBRILS (CRYSTALLINE REINFORCEMENT) [ ~ 45%] + HEMICELLULOSE (PARTIALLY CRYSTALLINE) & LIGNIN (AMORPHOUS) MATRIX [~ 40%] + WATER AND EXTRACTIVES (OILS & SALTS) * RELATION WITH MECHANICAL PROPERTIES + ANISOTROPY OF PROPERTIES + THE ROLE OF DENSITY + DEFORMATION BEHAVIOR (VISCOELASTIC --> ELASTIC) & HIGH AXIAL MODULUS AND STRENGTH/LOW TRANSVERSAL MODULUS AND STRENGTH + FRACTURE BEHAVIOR & HIGH TRANSVERSAL TOUGHNESS/LOW AXIAL TOUGHNESS Reading Assignemnt: Askeland; pp. 612-618 36807 ENGINEERING MATERIALS LECTURE # 15 MATERIALS SELECTION AND DESIGN ------------------------------ 1.- INTRODUCTION 1.1.- THE MATERIALS CYCLE 1.2.- MATERIALS SELECTION 1.3.- MATERIALS DESIGN AND DESIGN WITH MATERIALS 2.- MATERIALS SELECTION 2.1.- THE KEY QUESTIONS IN MATERIALS SELECTION * DEFINITION OF PERFORMANCE REQUIREMENTS AND SERVICE ENVIRONMENT * CORRELATION BETWEEN REQUIRED PERFORMANCE AND AVAILABLE PROPERTIES * DETERMINATION OF EFFECT OF PROCESSING ON PROPERTIES * AVAILABILITY 2.2.- STEPS IN MATERIALS SELECTION PROCESS * ANALYSIS OF REQUIREMENTS * IDENTIFICATION AND SCREENING OF ALTERNATIVE MATERIALS * EVALUATION OF CANDIDATE MATERIALS * DEVELOPMENT OF DESIGN DATA 2.3.- THE VARIOUS TYPES OF MATERIALS 2.4.- THE VARIOUS TYPES OF PROCESSES 2.5.- EVALUATION TECHNIQUES * COST-PERFORMANCE INDICES * WEIGHTED PROPERTY INDICES * VALUE ANALYSIS * FAILURE ANALYSIS * BENEFIT-COST ANALYSIS 3.- MATERIALS DESIGN AND DESIGN WITH MATERIALS 3.1.- THE DESIGN PROCESS STEPS * RECOGNITION OF A NEED * DEFINITION OF A PROBLEM * GATHERING OF INFORMATION * CONCEPTUALIZATION * EVALUATION * COMMUNICATION OF THE DESIGN 3.2.- BREAKDOWN OF THE TYPICAL DESIGN PROJECT * FEASIBILITY STUDY * PRELIMINARY DESIGN * DETAILED DESIGN * PLANNING FOR MANUFACTURE * PLANNING FOR DISTRIBUTION * PLANNING FOR USE * PLANNING FOR RETIREMENT OF THE PRODUCT 3.3.- AN EXAMPLE IN DESIGN WITH MATERIALS: DESIGNING THE LADDLE HOOKS FOR TRANSFER LADLES IN A STEEL- MAKING PLANT. 3.4.- AN EXAMPLE OF MATERIALS DESIGN: COMPOSITES FOR HIGH TEMPERATURE SERVICE